2 года назад
3 года назад
4 года назад
This video demonstrates the wafer cleave process, a crucial first step in fabrication. The process involves using a diamond cutter to carefully score a wafer, then applying pressure to break it along the cut line. The video highlights the importance of safety precautions, including dust extraction, and provides tips for successful wafer cleaving.
1890 4 года назад 5:23
3 года назад
9 лет назад
8 лет назад
2 года назад
15 лет назад
1 год назад
6 лет назад