Ishikawa Metal Co Soldering CC 適用於半導體、PCB、SMT、銅鋁異質焊錫、雷射焊錫、低錫油飛濺、低溫錫膏、錫(條)、介面活性劑(DIP減少錫爐保養時間)，歡迎申請送樣！ скачать в хорошем качестве

Ishikawa Metal Co Soldering CC 適用於半導體、PCB、SMT、銅鋁異質焊錫、雷射焊錫、低錫油飛濺、低溫錫膏、錫(條)、介面活性劑(DIP減少錫爐保養時間)，歡迎申請送樣！

Principles of Heterogeneous Soldering: Wettability Improvement: Using appropriate solder alloy combinations can enhance the wettability of the solder on different metal substrates, improving joint strength and reliability. Interface Reaction Control: Adjusting the solder composition can control the interfacial reactions between the solder and the substrate, suppressing the formation of detrimental intermetallic compounds and reducing soldering defects. Dross Suppression: Specialized solder formulations can effectively reduce the amount of dross (ドロス) generated during the soldering process, improving soldering efficiency. Thermal Stability: Maintaining the proper soldering bath temperature can ensure the stability of the soldering process and extend the service life of the soldering equipment. Advantages of Heterogeneous Soldering: ◎Reduced Soldering Dross (ドロス): Using K4S and Sn-3Ag-0.5Cu solder alloys can significantly reduce the amount of dross generated during the soldering process. This helps improve the productivity and reliability of the soldering process. ◎Enhanced Soldering Stability: Using the K4S solder can achieve longer-term stable soldering. Maintaining a 400°C soldering bath temperature can ensure the stability of the soldering process. Improved Joint Strength and Corrosion Resistance: The K4S solder exhibits higher joint strength and better corrosion resistance compared to the Sn-3Ag-0.5Cu solder. After a 40-day salt spray test, the corrosion life of the K4S solder is significantly longer. ◎Applicable to Different Terminal Materials: The soldering process can be applied to copper and aluminum wires, accommodating various terminal materials. After soldering, both copper and aluminum wires are uniformly wetted, ◎Forming good solder joints. In summary, this heterogeneous soldering technology can significantly improve the soldering process, enhancing the reliability and service life of the products. ======================================================== Welcome to Apply for Sample Testing of Heat Dissipation Products (Aluminum & Copper) Customers are welcome to contact us by phone or email to apply for sample testing of our heat dissipation products made of aluminum and copper materials. Our heterogeneous soldering technology can provide the following advantages for heat dissipation applications: Improved Wettability: The specialized solder alloy combinations enhance the wettability of the solder on different metal substrates, ensuring strong and reliable solder joints. Enhanced Thermal Stability: The carefully controlled soldering process and temperature maintenance can improve the thermal stability of the heat dissipation assemblies, extending their service life. Reduced Defects: The interface reaction control and dross suppression features of our heterogeneous soldering process help minimize soldering defects, improving product quality. Versatile Material Compatibility: The soldering method can accommodate both aluminum and copper heat sink materials, providing flexibility in product design. If you are interested in evaluating the performance of our heat dissipation products, please feel free to request sample parts for testing. Our technical team will be glad to provide professional guidance and support throughout the evaluation process. Please contact us at the following: Email: jacklin@nyp.com.hk Phone: +886-6-966-521-556 Website: www.nyp.com.hk We look forward to the opportunity to collaborate with you and demonstrate the advantages of our heterogeneous soldering technology for your heat dissipation applications.