MTI 300iSA - Wafer Metrology Demonstration скачать в хорошем качестве

MTI 300iSA - Wafer Metrology Demonstration

The Proforma 300SA is a semi-automated wafer metrology tool used in thickness measurement for both semiconducting and semi-insulating wafer materials. Capable of handling wafer diameters of 100mm, 200mm and 300mm, the Proforma 300SA provides highly accurate, repeatable measurements of thickness, TTV, wafer bow, warp, site and wafer global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning and characterization at the press of a button. User defined and ASTM / SEMI scan patterns are used to generate a full 3-dimensional (3-D) image of the wafer. Call us to learn more: +1(518) 218-2550