Longsys at MWC 2026 | Longsys Showcases Latest Integrated Embedded Storage Solutions скачать в хорошем качестве

Longsys at MWC 2026 | Longsys Showcases Latest Integrated Embedded Storage Solutions

Longsys (301308.SZ), a leading branded semiconductor memory enterprise, is showcasing its latest embedded integrated storage solutions at MWC 2026. Under the theme "AI Storage for the Mobile World", the company is demonstrating how its next-generation offerings empower the shift from basic functionality to high-performance, precision-driven storage for on-device AI. The comprehensive portfolio covers multi-scenario AI storage products designed for smartphones, wearables, and PCs. Addressing DRAM supply-demand challenges, Longsys introduces its proprietary HLC (High Level Cache) technology integrated into UFS products. By enabling the UFS to handle warm/cold data traditionally cached in DRAM, this innovation reduces terminal DRAM requirements, optimizing BOM costs for AI smartphones, tablets, and embodied robots while maintaining seamless user experiences. Furthermore, integrating pTLC technology within its UFS lineup allows for intelligent mode switching between QLC, TLC, and SLC via firmware. This delivers TLC-grade data retention with superior cost advantages over native TLC, balancing capacity, performance, and endurance for demanding AI applications.