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It has been a long-sought-after dream to integrate optoelectronic, photonic, and electronic components monolithically to achieve enhanced and enabling capabilities. Silicon photonics has demonstrated such a promise through its development over the past two decades. Thousands of optical components are integrated on one chip, mass-produced on 300-mm CMOS lines, and fully burned-in and tested at a wafer level. Pluggable optical transceivers ranging from 100- 800 Gb/s are in high-volume production and have become the mainstream in data center connectivity between Ethernet ports. Hybrid integration and advanced packaging provide an additional degree of freedom in design to achieve higher density, better signal integrity, reduced power consumption, and ultimately the continued scalability of network bandwidth density, performance, and cost. In this talk I plan to provide an overview of the process, device and circuit design, and applications of silicon photonics in areas such as optical transceivers, co-packaged optics, optical IO, and LIDAR.