Liquid Metal Failure: Improper Removal Caused LM to Seep Under CPU | Geld Technologies скачать в хорошем качестве

Liquid Metal Failure: Improper Removal Caused LM to Seep Under CPU | Geld Technologies

This video documents a real case of improper liquid metal (LM) removal handled prior to arriving at Geld Technologies. As shown, the liquid metal has migrated underneath the CPU, which is a serious red flag and indicates incorrect removal technique. When liquid metal is not properly controlled during removal, it can flow under the CPU package and into surrounding areas. ⚠️ Why this is dangerous: Liquid metal is electrically conductive. Once it migrates under the CPU, it can cause: Short circuits Corrosion over time Permanent CPU or motherboard damage This typically happens due to: Poor removal technique Excessive pressure during cleaning No masking or insulation of surrounding components Lack of experience handling liquid metal 🔧 Professional note from Geld Technologies: Liquid metal should only be applied and removed by trained technicians using proper insulation, controlled absorption, and inspection methods. Improper handling can easily turn a thermal upgrade into a board-level failure. This video is shared for educational purposes to help users and technicians understand the risks involved. 📍 If you’re unsure—don’t DIY liquid metal. Have it handled by professionals. 📞 Need Professional Help? If your device has liquid metal issues, overheating, or suspected board damage: 👉 WhatsApp: https://wa.me/60166669438 👉 Website: https://www.computerrepair.com.my 📍 Geld Technologies – Professional Laptop & Motherboard Repair (Malaysia) Over a decade of experience handling advanced thermal and board-level repairs.