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Functional systems realized in a fiber revolutionize multiple application areas, including wearables and apparel, environmental sensing, energy harvesting, and even tissue engineering. However, the realization of high-performance electronics in fiber is still in its infancy, seeking a uniform material processing strategy that would allow embedding optoelectronic and photonic devices into a fiber in an ordered, addressable, and scalable manner. Fiber-embedded optoelectronics realized in crystalline semiconductors, such as silicon or germanium, would manifest a superior sensitivity and bandwidth, on par with photodiodes fabricated by conventional CMOS technology. Moreover, photonic structures based in high refractive index materials, such as silicon, embedded in a fiber, allow beginning implementing integrated photonic systems, having a potential to compete in the not so distant future with the state-of-the-art silicon photonics. FAMES Lab develops a methodology for embedding 3D architectures typical to integrated microelectronic and photonic devices and systems within multi-material fibers [1]. This methodology, dubbed "VLSI for Fibers," or "VLSI-Fi," combines 3D printing of the preforms, a thermal draw of the fibers, a post-draw assembly of fiber-embedded integrated devices by means of a material-selective spatially coherent capillary break-up of the fiber cores, and a segregation-driven control of internal doping distribution in such liquid-phase assembled devices. We have demonstrated a scalable fabrication of a number of basic building blocks for integrated optoelectronics and photonics in fibers, such as photoconductive detectors, photodiodes, and photonic gratings [2], [3]. Targeting applications ranging from quantum sensing and computing to regenerative medicine and bioprinting, we believe that VLSI-Fi enables integrating those building blocks into complex systems and is a promising candidate to become a new standard for the fabrication of high-performance fiber-embedded functional systems. References [1] C. Faccini de Lima et al., Nanoscale Res. Lett. 14 (2019) 209 1–16 [2] A. Gumennik et al., Nat. Commun. 4 (2013) 2216 [3] L. Wei et al., Adv. Mater., 29 (2017) 1603033