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The video shows the most important stages of particleboard production: Wood logs are first debarked and then converted into chips. These chips are cut into smaller particles in a knife ring flaker. The chips are dried and glue is added. The glued chips are transported by a conveyor belt to the mat forming line. The mat consists of three layers: the bottom face layer (small needle-shaped particles that give the board bending strength and stiffness as well as a smooth surface), the middle layer (cubic chips that save wood material and provide a lower density) and the top face layer (same as on the bottom side). The mat is compacted in a cold pre-press and then transported to the hot press (in this case a Siempelkamp plant). In the first section of the hot press, the temperature is rapidly increased to about 200°C. The density of the mat is further increased and heat is transported from the hot surface layers into the core of the mat by means of the so called vapor effect. The viscosity of the pre-condensed MUF resin decreases and the resin starts to cure (second section of the press). In the third section, the pressure of the press is reduced and the plate cools down (in this case with the help of a re-cooling system) to reduce the vapour pressure in the plate and thus prevent vapour pockets from forming in the plate. Re-cooling allows productivity to be increased (higher press speed). Behind the press is a cross-cutting saw that cuts the continuously produced chipboard into smaller panel units. The boards are cooled, sanded, stored and then coated with melamine resin impregnated papers.