IPhone X flex cable pre-bonding and main-bonding скачать в хорошем качестве

IPhone X flex cable pre-bonding and main-bonding

OK, now let me introduce to you three structures of mobile phone LCD display. COG structure, COF structure and COP structure. OK, now this one in my hand is Samsung J6 prime. Please take a look at the COG structure, its driver IC is on the glass. Chip on glass. Chip on glass. This is named COG. This one is J6 prime. Then this one is the iPhone 6 plus, which is also the COG structure, its driver IC is on the glass. OK, now please take a look at this one. This one is the COF structure. This one is the iPhone x LCD of flexible screen, and its driver IC is on the flex cable. Its driver IC is on the flex cable. Now take a look at this one, its driver IC is on the flex cable, it is COF(Chip on FPC) on flex cable. This one is COF structure. The iPhone X model, of course, there are another models. There are another models and we can take a look. This one is backlight screen. This model screen, this one is the backlight screen of TFT, its driver IC is also on the flex cable. This structure is named the COF structure. And the third one is the COP structure, like the COP structure, it is more used in the flexible screen, especially the curved screen, curved screen. This model is s8 LCD screen, its driver IC is on the glass, but its screen is flexible. We can see that this screen is flexible, this one is s8. OK, let's have a look at another model, it's s8 plus. We can see that the driver IC is also on the screen, but its screen is flexible, we name it COP. Now we'll take a look, at the same magnification time, at the same magnification time, that the differences of screen circuits and IC of COG, COF and COP. Now this one in my hand is COG structure. OK, the circuits are regulated clearly. This is the place of bonding FPC. Now it's at 1.5 times magnification, the circuits are clear. We can see that the circuits are clear. We see three COG structures totally. This one is iPhone 6 plus. The circuits, the IC circuits are comparatively thick. Obviously, we can see that it's the COG circuits. Now we take a look at COF structure. This is HUAWEI Honor 8x, which is COF structure. You can see that the driver IC is on the flex cable. Evidently, the circuits are very close. This is the circuits place, we can see that the circuits are pretty close. This is the bonding place, the flex cable place. At the same magnification time, its circuits are very close. So when we bond, there are process differences. The circuits are quite close. Now we take a look at another, another iPhone x, iPhone x circuits. The iPhone x circuits are closer. This is the iPhone x circuits. At the 1.5 times magnification, we can't see the circuits clearly. Too close, the circuits of this place are too close. So using old bonding machine cannot meet the requirements of bonding. Then let me show you another flex cable. Look, this is the iPhone x circuits.The circuits are very close, very close. Therefore, the usual bonding machine can't bond it. Like our old COG machine, which also cannot let us see the close circuits of iPhone x clearly. And there's no way to align. Now we'll take a look at the third COP structure. Let's take a s8+ flex cable and separate it to watch the flex cable directly. This is s8 plus circuits, which is comparatively thick. So far the closest circuits are the COF circuits, in other words, the COF circuits are the closest.