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Low-Temperature co-fired ceramic (LTCC) substrates have been widely used in passive component design for over 30 years, giving designers advantages of extremely small size, high reliability, repeatability at production volume, and low cost. Until recently, commercially available LTCC components were limited to discrete functions operating under 10 GHz due to the inherent characteristics of device design and construction, but recent advances have brought about numerous breakthroughs enabling novel capabilities for applications with more demanding requirements. This workshop will provide a survey of recent innovations in LTCC component design including filters for millimeter-wave and sub-THz passbands, high-rejection filters, reflectionless filters, LTCC air-cavity packaging and integrated surface-mountable devices. Emphasis will be placed on the role of material systems, circuit topologies, simulation models and other design techniques used to develop these components.