Optimizing Chip-Package-PCB Integration for High-Speed Data Transmission: PAM4 Signaling 224+ Gbps скачать в хорошем качестве

Optimizing Chip-Package-PCB Integration for High-Speed Data Transmission: PAM4 Signaling 224+ Gbps

Dive into the world of high-frequency electronics with our expert-led presentation on 'Optimizing Chip-Package-PCB Integration for High-Speed Data Transmission. This video is a must-watch for professionals and enthusiasts in the field of high-frequency electronics and communication engineering. It is presented by Syed Bokhari, Signal Integrity and EMC Architect at Fidus Systems Learn about: the critical role of high frequencies in system performance, especially in the realm of PAM4 signaling at speeds exceeding 224 Gbps the intricacies of S parameter simulation accuracy and the limitations of cascade theory at ultra-high frequencies insights into optimizing return loss in chip-package interconnects to significantly boost system performance the importance of precise package-PCB integration for realistic simulation outcomes and the optimization of individual components like microvias, core vias, and BGA balls the strategic placement of transmission line ports for enhanced simulation accuracy and the necessity of visual structure reviews and actual measurements for validation. #HighSpeedDataTransmission #PAM4 #ChipPackagePCB #ElectronicsEngineering #CommunicationEngineering #SParameterSimulation #PCBDesign #ElectronicSystemOptimization" ** For over 25 years, Fidus has been delivering electronic product design and development solutions for extraordinarily complex, high bandwidth and low latency projects and firmly remains placed as AMD’s Premier Partner. Our FPGA and ASIC, hardware, software, FPGA, verification, wireless, mechanical, and signal integrity teams work to innovate, design and deliver next-generation products for customers in emerging technology markets. With over 400 customers and 3000+ completed projects, we have teams of domain experts available to extend your capacities seamlessly and commitment to getting designs and prototypes to market faster, and right the first time. Learn more at http://www.fidus.com.