Laser Decapsulation Machine MDSL-LD3030 скачать в хорошем качестве

Laser Decapsulation Machine MDSL-LD3030

The laser decapsulation machine easily and conveniently removes the encapsulation layer from plastic-encapsulated semiconductor devices, exposing the lead frame on the substrate. It can easily handle full-surface, targeted, or even flat decapsulation of plastic encapsulation material, significantly reducing the amount of acid used and the time required for chemical decapsulation, while maximizing the success rate of decapsulation. It is capable of decapsulating a variety of plastic-encapsulated devices, including integrated circuits and discrete components. Application Areas: laser decapsulation system designed for precise and efficient removal of epoxy and plastic molding materials. If you also have requirements for related equipment, you can visit our official website： www.minder-hightech.com www.minder-semicon.com or contact our engineer: 【Minder Hu】 WeChat/Whatsup: 15813334038 Email: minder@minder-hightech.com shunyu.hu@163.com