FINEPLACER® femto pro launch at Laser World of Photonics. скачать в хорошем качестве

FINEPLACER® femto pro launch at Laser World of Photonics.

BOOTH VISIT DAY 4. FINEPLACER® femto pro launch at Laser World of Photonics. Berlin-based Finetech has been one of the highlights for me this time with the world premiere and demo of their fastest production die bonder to date, the FINEPLACER® femto pro. It is designed to set a new benchmark in high-precision micro-assembly. The new machine combines unmatched bonding speed with very high accuracy. It will be of interest to anyone involved in advanced packaging applications, including Silicon Photonics, Photonic Integrated Circuits, Co-Packaged Optics, and Quantum Photonics. In the video interview below, we had the chance to catch up with Melanie Schmidt and Travis Scott to discuss topical trends in active or passive alignment, as well as the growing complexity that brings significant challenges to many manufacturers. How is Finetech answering market demands? Additionally, Optica corporate member Finetech has been showcasing the FINEPLACER® lambda 2, the ideal tool for R&D and prototyping. Check them out at Booth B2.414 and A2.136 or follow up after this amazing show at Messe Muenchen.