SNIA CMSS23 - UCIe : An Open Standard for Innovations at the Package Level скачать в хорошем качестве

SNIA CMSS23 - UCIe : An Open Standard for Innovations at the Package Level

High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of the emerging compute landscape. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, and client computing infrastructure. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape. UCIe is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets on a package; similar to the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express®, Universal Serial Bus (USB)®, and Compute Express Link (CXL)®. In this talk, we will discuss the usages and key metrics associated with different technology choices. We will also delve into the different layers as well as the software model along with the compliance and interoperability mechanisms. Presented by Dr. Debendra Das Sharma, UCIe Consortium Learn More: SNIA Compute+Memory+Storage Summit: https://www.snia.org/cms-summit SNIA Website: https://snia.org/ SNIA Educational Library: https://snia.org/library Twitter:   / snia   LinkedIn:   / snia