Ziptronix Technology used for BSI Image Sensors скачать в хорошем качестве

Ziptronix Technology used for BSI Image Sensors

Ziptronix has been developing wafer scale bonding for more than 10 years and today the mobile industry demands a more capable image sensor. That demand is driving the manufacturers of image sensors (Sony, Omnivision, Toshiba, Panasonic, Aptina, many others) to turn to a technology called Backside Illuminated image sensors. In order to make the most efficient, cost effective and technologically superior BSI image sensor, many in the industry are turning to using Direct Low Temperature Oxide Wafer Bonding to achieve this type of device. Ziptronix holds a significant patent portfolio throughout the world covering Direct Low Temperature Oxide Wafer Bonding and currently offers this technology to the world through its Licensing Program.