Скачать с ютуб Surface Mount Technology (SMT) Assembly Process в хорошем качестве

Surface Mount Technology (SMT) Assembly Process

In this video, we show the entire process of Surface Mount Technology (SMT) Pick and place assembly. This will be a step by step process on how Bittele Electronics conducts this process. To know more: https://www.7pcb.com Capabilities We have the capabilities to assemble SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or double-sided component insertions. Our production facilities can assemble the following SMT types: Ball Grid Array (BGA) Ultra-Fine Ball Grid Array (uBGA) Quad Flat Pack No-Lead (QFN) Quad Flat Package (QFP) Small Outline Integrated Circuit (SOIC) Plastic Leaded Chip Carrier (PLCC) Package-On-Package (PoP) Small Chip Packages (pitch of 0.2 mm) We are also capable of through-hole parts. For passive components, our equipment can work with chips as small as ultra-small 0201 series. The processes covered in this video are given below: Process 1: Loading the Feeders The first step in the SMT assembly line is to load the feeders with the surface mount components that will be placed on the board. Each feeder is loaded with only one type of component to maintain consistency and supports component sizes 0201 and upward. Process 2: Programming the Pick & Place Machine The next step would be to program the pick and place machine. In this part of the process, the orientation, location and pad size for the SMT components will be programmed on to the machine from the Pick and Place files. Process 3: Programming the Stencil Machine Then, the stencil printer is programmed to ensure that stencil aligns directly with the SMT pads for the boards Process 4: Paste Printing After the stencil printer has been setup, we will print the solder paste on to the boards through the stencil Process 5: Pick and Place Machine After the paste has been printed on to the boards, the boards are now ready to go through the pick and place machine. The components are now placed on to the boards by the nozzles. Our machine is capable of mounting about 20-30k components in an hour. Process 6: Oven The boards exit the pick and place machine and make their way into the oven where they spend about 5-7 minutes inside a 10-zone oven. The solder paste is reflowed in this stage and the components are fully soldered on to the boards. We use RoHS compliant SAC305 solder paste so the boards are heated to about 235-245°C. You can also follow us on our social media channels: Facebook:   / bittele-electronics-1573113576043463   Twitter:   / bittele7pcb   LinkedIn:   / 2647769   YouTube:    / @7pcbbittele