Day 1 Highlights | Conprofe at SEMICON West 2025！ скачать в хорошем качестве

Day 1 Highlights | Conprofe at SEMICON West 2025！

The first day of SEMICON West was filled with innovation, interaction, and excitement! At Booth 1481, we’re presenting our one-stop turnkey solutions powered by Ultrasonic-Green CNC Machining, including: ✨ Ultrasonic-Green Engraving & Milling Center ✨ Ultrasonic Machining Technology ✨ Press-Fit Unit ✨ Ultrasonic Shrink-Fit Tool Holder ✨ Ultrasonic Press-Fit Tool Holder ✨ Solid PCD Cutting Tools — delivering ultra-deep micro-drilling and micron-level surface finishing on hard-brittle, metallic, and engineering plastic materials. Our ultrasonic solutions help semiconductor manufacturers achieve exceptional surface quality and precision, extend tool life, boost productivity, and enhance process stability — ensuring reliable, high-performance results for advanced semiconductor applications. Alongside our product showcase, visitors experienced interactive demo zones featuring micro-hole observation, ultrasonic machining technology, and more, as well as a display of CVD-SiC showerhead, single-crystal silicon curved electrode, probe card, and other workpieces, offering an up-close look at precision manufacturing in action. 📍 Visit us at Booth 1481 and discover how Conprofe’s technology is driving the future of semiconductor manufacturing. #Conprofe #Semiconductor #UltrasonicMachining #SiC #ProbeCard #Innovation #Technology #Manufacturing #PCD #MicroDrilling #SEMICONWest #ConprofeGlobal #Highlights Ms. Esther HU Senior Sales Director Tel/WhatsApp: +86-138 2607 9999 Email: esther.hu@conprofetech.com Web: www.conprofecnc.com