Скачать с ютуб CXMT, Fujian Jinhua, YMTC Leading China Memory Chip : Samsung and SK will collapse within 2 years. в хорошем качестве

CXMT, Fujian Jinhua, YMTC Leading China Memory Chip : Samsung and SK will collapse within 2 years.

CXMT, Fujian Jinhua, YMTC Leading China Memory Semiconductor South Korean memory companies Samsung Electronics and SK Hynix will collapse within two years. The Chinese memory semiconductor companies are led by the following three companies. China's efforts are currently focused on HBM2. Mobile DRAM: Changxin Memory (CXMT) Server DRAM: Fujian Jinhua NAND Flash: Yangtze Memory Technologies (YMTC) Each company is developing and preparing for mass production of its own HBM. CXMT CXMT, China's top DRAM chip maker, has developed a sample HBM chip in cooperation with Tongfu Microelectronics, a chip packaging and testing company. Huawei has collaborated with Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, which are responsible for wafer packaging or CoWoS, along with XMC.CXMT has filed about 130 patents in the United States, China, and Taiwan on various technical issues related to the manufacturing and function of HBM chips. Of these, 14 were published in 2022, 46 in 2023, and 69 in 2024. One of the Chinese patents released last month shows that the company is looking into advanced packaging technologies such as hybrid bonding to create more powerful HBM products. Separate filings also show that CXMT is investing in the development of technologies needed to create HBM3. At least 17.1 billion yuan will be invested in 2024! Changxin Technology plans to build a production base in Shanghai for advanced packaging and memory chip testing, and has secured a 130,000 square meter industrial site in Shanghai’s Pudong area. CXMT is also said to be planning a major expansion at its Hefei plant in 2024, which makes sense given that the company supplies LPDDR5 memory chips to two leading smartphone manufacturers, Xiaomi and Transsion. According to the report, the company’s Phase 1 Hefei plant is nearing full production with a monthly wafer production capacity of about 100,000 wafers. The expected Phase 2 expansion is expected to add an additional 40,000 wafers per month by the end of the year, giving CXMT a share of about 10% of global DRAM production capacity. Changxin Memory Technology (CXMT), China’s leading DRAM manufacturer, is expanding its high-bandwidth memory (HBM) production capacity at its Hefei plant. The site’s initial production capacity is about 50,000 12-inch wafers per month, which is about one-third of the HBM production capacity of major Korean manufacturers such as SK Hynix and Samsung Electronics, which produce 120,000 to 130,000 wafers per month. At least 17.1 billion yuan will be invested! Changxin Technology plans to build a production base in Shanghai for advanced packaging and memory chip testing, and has secured a 130,000-square-meter industrial site in Shanghai’s Pudong. YMTC Wuhan Xinxin is building a factory capable of producing 3,000 12-inch HBM wafers per month, and construction was scheduled to begin in February 2024. Wuhan Xinxin Semiconductor Manufacturing (XMC) also announced its latest bid project for the R&D of advanced packaging technology and production line construction for HBM (High Bandwidth Memory) The project demonstrates the company’s ability to apply 3D integrated multi-wafer stacking technology to develop domestically produced HBM products with higher capacity, greater bandwidth, lower power consumption, and higher production efficiency. XMC’s latest project, which plans to add 16 sets of equipment, aims to achieve a monthly production capacity of more than 3,000 wafers (12 inches), demonstrating its ambition to become the first HBM foundry in China. On December 3, 2018, XMC announced the successful development of 3D wafer stacking technology based on its 3D integrated technology platform. This represents a significant advancement for the company in the field of 3D integration technology, enabling higher density and more complex chip integration. At present, XMC has made great progress in the research and development of 3D integrated multi-wafer stacking technology. This is evident in the successful development of 3D integrated technology using back-illuminated 3D integration technology. This includes the advancement of image sensors, HBM technology research and industrialization efforts, and the innovation of 3D NAND projects. Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC), a NOR flash manufacturer, recently disclosed that it has submitted an IPO consultation document to the Hubei Securities Regulatory Commission, according to the official website of the China Securities Regulatory Commission. Huawei Technologies has collaborated with Chinese foundry Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. to develop high-bandwidth memory (HBM) chips. Huawei has teamed up with JCET (Jiangsu Changjiang Electronics Technology) and Tongfu Microelectronics, which are responsible for wafer packaging or CoWoS, along with XMC.