Innovator3D IC wins 3D InCites Technology Enablement Award скачать в хорошем качестве

Innovator3D IC wins 3D InCites Technology Enablement Award

Today we’re seeing semiconductor package designs with upwards of 50 million pins – and we predict that number may rise to 500 million soon with the greater adoption of chiplets. To support this level of complexity, we created an entirely new, consolidated design cockpit called Innovator3D IC Integrator for streamlining 3D IC design planning, prototyping and analysis. With a unified data model, it allows engineers to construct a digital twin of the entire semiconductor package assembly. This is such a significant accomplishment that 3D InCites named it a winner in their 2025 Technology Enablement Awards. We’re very proud of the work we’ve done to earn this recognition. This is a truly transformative solution for our customers that will allow them to create optimized, production-ready, market-leading products! ▶️ Connect with us: » LinkedIn: https://sie.ag/6uPW8U » Blog: https://sie.ag/4u993T » Siemens EDA 3D IC podcast: https://sie.ag/5ihuRt » IC packaging community discussion board: https://sie.ag/9BcU7 » Learn more about the Innovator3D IC solution suite: https://sie.ag/Jd2de #Semiconductor #ElectricalEngineering #Engineering #ICdesign #SemiconductorElectronics