Augmented Silicon Photonics for Data Center and AI/ML optical interconnects скачать в хорошем качестве

Augmented Silicon Photonics for Data Center and AI/ML optical interconnects

Yannick Paillard, Chief Commercial Officer, SCINTIL Photonics The computing and data needs of AI are growing exponentially, even faster than core semiconductor technologies. Parallelism is necessary to address this challenge with optical interconnects penetrating deeper into data centers and HPC clusters to enable higher data throughput and lower power consumption. Although silicon photonics can provide the densest and most cost-effective solution, it cannot integrate lasers. During the presentation, I will describe SCINTIL's technology for heterogeneous integration of III-V materials, leveraging foundry standard silicon photonics, to deliver PICs with monolithically integrated DFB lasers and SOA . I'll finish with the benefits of our PIC solutions to support terabit capacities with CWDM4 transmitter for Pluggable Optics and DWDM external laser source for Co-Packaged Optics