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What do first-class flights and High Bandwidth Memory (HBM) for AI applications have in common? Everything — and the seats are gone. At this year’s COMPUTEX/InnoVEX, we sat down with ATP (@Atpincelectronics)’s Jeff Hsieh to discuss how memory technology is adapting to AI, the rise of domain twins in manufacturing and why cross-enterprise data collaboration is the next big shift in industrial AI. 📺 Follow the AI revolution in detail with our playlist: • AI & Innovation | CONNECTED #CONNECTEDAIAndInnovation #AIAndInnovation 00:00 Importance of memory and storage in AI 02:08 Market volatility and supply-demand cycles 03:20 Memory market: ‘First class is completely sold out’ 04:40 Geopolitical pressures on supply chains 06:10 ATP’s agile supply chain strategies 07:41 Taiwan’s role in tech innovation at COMPUTEX 2024 08:05 Defining the AI NEXT theme 09:24 How ATP uses AI for business optimization 11:54 Balancing innovation, data ethics and security 12:12 Future of collaborative AI in B2B #COMPUTEX @COMPUTEXtv @COMPUTEXTAIPEIshow @InnoVEX_taipei StayConnected | Follow us on Instagram: / connected.taiwanplus Find more news stories at TaiwanPlus News: Facebook: / taiwanplusnews YouTube: / @taiwanplusnews Tweet us on Twitter/X: / taiwanplusnews TaiwanPlus|https://www.taiwanplus.com TaiwanPlus presents the country’s unique voice on not only local issues but also world events.