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Advanced Composite Thermal Management Materials and Applications

On June 26 Carl Zweben presented a live webinar on Advanced Composite Thermal Management Materials and Applications. Overview: This presentation covers key advanced composite thermal management materials and applications. We also look at current and future advanced reinforcements, such as diamond particles, carbon nanotubes, graphene and graphite nanoplatelets. The first of a new generation of advanced composite thermal materials, silicon carbide particle-reinforced aluminum (Al/SiC) was first used in thermal management by the speaker's GE group in the 1980s. It is now well established in a wide range of commercial and aerospace/defense applications. There are now an increasing number of new composites with thermal conductivities up to ~1000 W/m-K, more than twice that of copper. They also have low densities and low coefficients of thermal expansion (CTEs). Some are cheaper than traditional materials. Payoffs include: reduced component and system cost; reduced weight; increased reliability; reduced junction temperatures; increased power and light output; low-CTE, thermally conductive printed circuit boards (PCBs), potentially eliminating the need for underfill; CTE matching allows direct attach with hard solders, reducing thermal resistance and solder fatigue; and others.