MLS300 Ultra‑Precision Water‑Jet Guided Laser Machine for Ceramics, Wafers & SiC скачать в хорошем качестве

MLS300 Ultra‑Precision Water‑Jet Guided Laser Machine for Ceramics, Wafers & SiC

MLS300 Ultra‑Precision Water‑Jet Guided Laser Processing System, independently developed and manufactured by Mingseal. The MLS300 is designed for ultra‑precision processing of a wide range of hard and brittle materials, including: Ceramic substrates Liquid metal materials Wafers Diamond heat spreaders Silicon carbide (SiC) And other materials with different thicknesses and hardness With the MLS300, you can achieve: Ultra‑precision cutting, drilling, and coring Processing accuracy within ±10 μm Stable quality for advanced electronics, semiconductor and power device applications Whether you are working in semiconductors, advanced packaging, power electronics, LED, or precision manufacturing, the MLS300 provides a high‑accuracy, high‑stability solution for next‑generation production. 🔔 Subscribe to our channel for more updates on ultra‑precision laser processing solutions. 📩 For inquiries and technical details, please contact us: market01@mingseal.com