Thermal-Mechanical Streamlined Workflow: FLOEFD Simcenter 3D скачать в хорошем качестве

Thermal-Mechanical Streamlined Workflow: FLOEFD Simcenter 3D

Streamlined workflow that includes Xpedition, Simcenter T3STER, Simcenter Package Creator, Simcenter FLOEFD for NX and Simcenter 3D for accurate thermo-mechanical stress simulation. A flip-chip BGA package, developed in Package Creator, is calibrated using Simcenter FLOEFD for NX and Simcenter T3STER. The calibrated IC package model is mounted on a PCB processed in EDA Bridge from Xpedition and simulated in a transient environment. The 3D model with transient temperature data is used to simulate thermo-mechanical fatigue and creep in Simcenter 3D. ‪@SiemensSoftware‬ ‪@SiemensKnowledgeHub‬