Surpassing the Limits of Moore's Law through "Packaging"?The Mighty Packaging Alliance of TSMC! скачать в хорошем качестве

Surpassing the Limits of Moore's Law through "Packaging"?The Mighty Packaging Alliance of TSMC!

00:00 Apple WWDC Keynote, Vision Pro, and M2 Chip 00:58 Advertisement Segment 01:32 Has Moore's Law Reached Its Limit? 03:43 Surpassing Moore's Law!? 04:16 What is Packaging? 05:24 Chiplet Integration, SoC, and SiP - What Are They? 06:37 What is 3D Advanced Packaging? 08:26 Challenges of Advanced Packaging 10:23 TSMC's 3DFabric Alliance 11:56 Conclusion // Further Reading // Image Chips Like Sandwiches - Three-Dimensional Ultra-Thin Packaging Interconnect Chip Technology https://pansci.asia/archives/55595 A Sudden Revelation While Bathing: The Nobel Prize-Worthy Patent of the Eight Traitors - Semiconductor "Planar Process" - "Revolutionary Genius: Shockley and the Eight Traitors" https://pansci.asia/archives/351843 // References // https://www.charmingscitech.nat.gov.t... https://www.tsmc.com/chinese/news-eve... https://www.tsmc.com/english/dedicate... https://3dfabric.tsmc.com/english/ded... https://blogs.sw.siemens.com/semicond... https://semiwiki.com/uncategorized/97... https://www.bnext.com.tw/article/6302... https://ctee.com.tw/news/tech/832581.... https://www.bnext.com.tw/article/5665... https://www.techbang.com/posts/105326... // Production Team // Host: Kuowei Cheng Planning: Hsieh Fu-Cheng Script: Hsieh Bing-Yi Editing: Chen Yun-Xin Want more interaction with us? Become a member ► https://lihi1.com/BWeoe