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Trump recently announced that TSMC plans to invest $200 billion in the United States. The market had various different opinions and speculations, and some even thought it was a slip of the tongue by Trump. TSMC did not comment at the time. However, according to the latest intelligence from the corporate circle, TSMC has invested an additional US$35 billion to build two new advanced process wafer foundries, and the process will be synchronized with Taiwan's latest advanced process. The WoS process at the back end of packaging and testing will be entirely handed over to the US company ATK, rather than ASE Technology Holding. TSMC's Chiayi packaging and testing plant will go into mass production in three years, which requires a large amount of manpower. It is recruiting technicians for the advanced packaging manufacturing department and the advanced packaging engineering department. The number of positions is not limited, and graduates from high school or above are required, regardless of major. They must have basic English and document software skills. The work system is 4 shifts and 2 rotations, working 2 days and resting 2 days, and they will need to work day and night shifts for 3 to 5 months. TSMC will start mass production of 2nm process in the second half of the year. Samsung and Intel also plan to advance their process technology to 2nm this year. The advanced process of wafer foundries will enter the 2nm generation competition. Market research firm TrendForce said that based on product and process scale, TSMC is expected to take the lead in 2nm. #TSMC #2nm #Kaohsiung #FabExpansionCeremony #Intel #Packaging #Amkor #Chiayi