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00:00 PCB Layers in KiCad 00:24 List of KiCad Layers 01:04 Copper Layer 05:15 Adhesive Layer 06:39 Solder Paste Layer 10:39 Silk-Screen Layer 15:16 Solder Mask layer 17:05 User Drawing layer 18:37 User Comments 19:37 User Eco1 & Eco2 20:18 Edge Cut layer 22:31 Margin Layer 24:19 Courtyard Layer 26:45 Fabrication Layer 28:18 User Layer 29:47 Summary Of KiCad Layers Understanding the PCB layers in KiCad is crucial for designing printed circuit boards effectively. KiCad provides several layers, each serving a specific purpose in the PCB design process. Here's an overview of the main PCB layers in KiCad and their functions: 1. Top Copper Layer (F.Cu): Represents the top layer of copper traces and pads on the PCB. Used for routing signal traces and placing surface-mount components. 2. Bottom Copper Layer (B.Cu): Similar to the top copper layer but represents the bottom layer of copper traces and pads. Used for routing signal traces and placing surface-mount components on the bottom side of the PCB. 3. Silkscreen Layers (F.SilkS, B.SilkS): Used for adding human-readable markings on the PCB, such as component outlines, reference designators, and logos. Helps with component placement and assembly. 4. Solder Mask Layers (F.Mask, B.Mask): Indicates areas where solder mask should be applied over the copper traces and pads to prevent solder bridges during assembly. Protects exposed copper areas and ensures proper soldering by preventing shorts between adjacent traces or pads. 5. Edge Cuts Layer (Edge.Cuts): Defines the outline of the PCB, including its shape and dimensions. Specifies the physical boundaries of the board and determines its final form factor. 6. Drill Guide (Drill): Contains the drill hole locations for mounting components, through-hole vias, and other mechanical features. Provides instructions for the PCB manufacturer on where to drill holes in the board. 7. Courtyard Layer (Cmts.User): Defines the recommended placement area for components, typically larger than the actual component outline. Helps ensure proper spacing and clearance between components for assembly and soldering. 8. Assembly Layer (F.Fab, B.Fab): Contains assembly-related information such as component outlines, polarity markings, and assembly notes. Aids in the assembly process by providing visual guidance for component placement and orientation. Understanding and effectively utilizing these PCB layers in KiCad is essential for creating well-designed and manufacturable printed circuit boards. Each layer serves a specific purpose and contributes to the overall functionality and reliability of the final PCB design.