У нас вы можете посмотреть бесплатно ChipMaster SMD-1000 Motorola Training Video 1994 APE.com или скачать в максимальном доступном качестве, видео которое было загружено на ютуб. Для загрузки выберите вариант из формы ниже:
Если кнопки скачивания не
загрузились
НАЖМИТЕ ЗДЕСЬ или обновите страницу
Если возникают проблемы со скачиванием видео, пожалуйста напишите в поддержку по адресу внизу
страницы.
Спасибо за использование сервиса ClipSaver.ru
ChipMaster SMD-1000 Motorola Training Video 1994. Original ChipMaster SMD-1000 walk through. First Hot Air Rework system used for 225 OMPAC BGA IC. Manufacturer www.APE.com Model 8100-1003OG Description: Part Number: 8100-1003OG Model: SMD-1000 https://www.ape.com/chipmaster-smd-10... The original "Patented" ChipMaster SMD-1000, developed with Motorola in 1991, is the first benchtop rework system to replicate a production oven temperature profile for rework. The Chipmaster SMD-1000 system is a reliable SMT Component PCB rework and repair system, suitable for small to medium PCB assemblies, BGA and SMT components, requiring Profile Temperature Control. Wide Ranging The Chipmaster SMD-1000 PCB repair system covers a wide range of SMT components providing a controlled PCB rework environment, which cares for your repair process. The system features a simple operation with automatic "Timed" process control and selected thermal BGA profiling. Energy Rework Reflow What makes the Chipmaster different from other Hot Air SMT rework machines is CONVECTION POWER! Its high-power heater reworks sensitive components at original Convection Oven temperatures. Lead Free Rework Oven Temperature Convection Rework is critical when reworking Lead Free components. The SMT component reflow temperature is higher for Lead- Free materials but the heat source should be kept to an optimum convection temperature to avoid damaging surrounding SMT components. Replicating the manufacturing method using a convection hot air reflow technology is the safest method The Chipmaster requires an APE Bottom Heater featured on page 10 for Lead Free rework and repair. Solder Integrity The following micro sections indicate the superior quality of a solder junction when operating at Low Temperature using the Chipmaster. Chipmaster Rework Temperature At the original Convection Oven Temperature integrity of solder remains intact. Common Low Power Rework Temperatures With air temperatures greater than the original Convection Oven Temperature the integrity of solder begins to break down. Product Specifications Motorola Part Number R1478A Power 1200 Watts Current 10.90 Amp @ 110V, 5.45 Amp @ 220V Dimension 22.25" x 9.25" x 8.62" 362 x 235 x 219 mm PCB Holder Standard 8" x 8" 203 x 203 mm Nozzles included: User may select alternatives 8100-0000-44 0.80" x 0.80" 20.3 x 20.3 mm 8100-1424 0.71" x 0.40" 18.0 x 10.2 mm 8100-1075 1.00" x 0.75" 25.4 x 19.0 mm Temperature Selectable Fahrenheit or Celsius Air Velocity 12.7 CFM Vacuum Internal Pump Air Source Internal Blower Controller Fuzzy Logic PID Shipping Standard 8100-1003 24" x 12" x 16" Weight 35 lb (15.9 kg) Accessories Included SMT Tool Kit 8100-1097 Accessories Optional Halogen Light 8100-0598