基于机器视觉的晶圆探针长度测量2021 02 13Wafer Probe Length Measurement Based on Machine Vision скачать в хорошем качестве

基于机器视觉的晶圆探针长度测量2021 02 13Wafer Probe Length Measurement Based on Machine Vision

背景介绍：随着科学技术的日益发展和制造技术的不断提高,一方面,大量出现的复杂形面、薄壁和微小尺度等特征零件难以采用传统的接触式测量方法；另一方面,越来越高的工业产品质量要求及其一致性要求大大增加零件的检测覆盖率,对测量速度提出了更高的要求。传统的接触式测量方法和装备因其与工件接触、测量时间长和人为误差大等局限性而难以满足当前一些产品的检测要求。本文重点研究了机器视觉测量中的图像去噪、边缘检测、图像拼接以及几何量测量等关键技术,开发了一种基于机器视觉的非接触式零件测量系统,其中包括距离、直径、角度、直线度、平行度和圆度等几何量的测量。本文主要对台积电生产线上的晶圆探针压入的长度，采用四路相机，实时采集4路图像，然后基于图像处理的方法，检测探针，并进行长度测量。 Background: With the development of science and technology and the continuous improvement of manufacturing technology, on the one hand, a large number of features such as complex surface, thin wall, and micro-scale parts are difficult to use the traditional contact measurement method; On the other hand, the higher and higher quality requirements of industrial products and their consistency requirements greatly increase the detection coverage of parts and put forward higher requirements for the measurement speed. Traditional contact measuring methods and equipment is difficult to meet the requirements of some products due to their limitations such as contact with the workpiece, long measuring time, and large human error. In this paper, the key technologies of machine vision measurement such as image denoising, edge detection, image splicing, and geometric measurement are studied. A non-contact part measurement system based on machine vision is developed, which includes the measurement of geometric parameters such as distance, diameter, Angle, straightness, parallelism, and roundness. In this paper, the length of the wafer probe pressed in the production line of TSMC is measured by using a four-way camera to collect four-way images in real-time, and then the probe is detected and the length is measured based on the image processing method.