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Understanding DDR5 and LPDDR5: Key Signal Integrity (SI) and Power Integrity (PI) Challenges - Presentation by Hans Klos In this informative technical presentation, Hans Klos dives deep into the signal integrity (SI) and power integrity (PI) challenges faced in high-speed memory designs like DDR5 and LPDDR5. The session covers crucial factors engineers must address to optimize their designs, focusing on the increasing data rates and the accompanying electrical effects. Key Topics Covered: Signal Integrity Challenges: With higher data rates, shorter bit periods, and faster rise times, DDR5 introduces new complexities. The discussion highlights the impact on insertion loss, return loss, crosstalk, and timing margin, emphasizing the need for power-aware simulations. Power Integrity for DDR5/LPDDR5: The presentation explores how decreased device supply and I/O voltages affect power supply impedance and noise margin. Special attention is given to the new JEDEC standards for DDR5 and how AC decoupling simulation plays a pivotal role in optimizing Power Distribution Networks (PDN). Simulation Models and PCB Design: Hans Klos also discusses the importance of accurate IBIS-AMI models and package simulations, 3D integration, and PCB material considerations. Challenges like insertion loss, dielectric constant variations, and glass weave skew effect are discussed to help mitigate common design problems. Key Design Recommendations: Learn about the importance of routing topology (Fly-by), routing symmetry, managing stub lengths, and the role of simulation in validating layout decisions. Vendor guidelines, while a great starting point, may not be sufficient for meeting performance requirements. Why Power-Aware Simulation is Critical: As technology evolves towards 6.4Gbps data rates with 3.2GHz system clocks, the potential for power-noise induced issues increases significantly. Power-aware SI analysis is critical at the chip, package, and PCB levels to meet the performance requirements of DDR5. Watch the full presentation for insights on: Addressing signal integrity challenges for DDR5 and LPDDR5 designs. Power integrity simulations and their growing necessity with DDR5 standards. Best practices for stack-up design, layout, and pre-layout simulations to achieve optimal performance.