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Thermal Mixed Technology

Thermal PCBs are specially engineered to manage and dissipate heat generated by high-power electronic components. They're essential in applications where traditional FR4 PCBs would fail due to thermal stress, such as LED lighting, power electronics, and RF systems. Thermal PCBs are designed specifically to manage and dissipate heat generated by active components. They typically incorporate: • Metal Core PCBs (MCPCBs) with aluminum or copper cores. • Ceramic-based substrates such as aluminum nitride (AlN) or beryllium oxide (BeO). • High-Tg FR-4 materials with thermal vias and heat-spreading planes.