Combined Heat Compute: Challenges & Opportunities Through AI скачать в хорошем качестве

Combined Heat Compute: Challenges & Opportunities Through AI

The data centre environment is changing. Liquid cooled AI data centres are becoming the new design focus. Mainly in the US, there are currently gigawatts of liquid cooled data centre sites in development. Consequently, the number of high-density racks will increase, as these high-performance AI chips are very hot. This requires liquid cooling (direct to chip or immersion cooling), as liquid cooled racks are offering a better cost-performance. At the same time, it will lead to reduced data centre floor space, less energy consumption and a facilitated utilisation of the heat rejection from server racks. Panel discussion at Data Centre World 6th of March 2024 Chairperson Stefan Frenzel, MD - Independent Consultant DME Speakers Deborah Andrews, Professor of Design for Sustainability & Circularity - LSBU Isabelle Kemlin, Business and Innovation Executive - RISE Research Institutes of Sweden David Gyulnazaryan, Independent consultant - Impleon