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ALT Recon Process introduction

ALT’s RECON process, which converts tested wafers into a stable, traceable format for downstream assembly. The automated flow covers wafer loading, tape/ring mounting, vision alignment, inspection, and map verification, followed by selective die handling based on known-good results. By minimizing manual contact, the process reduces contamination and chipping risk while improving repeatability and throughput. RECON supports efficient back-end manufacturing for power devices, sensors, and advanced packaging applications.