MERGEN Depaneling Machine "MDM" скачать в хорошем качестве

MERGEN Depaneling Machine "MDM"

The innovated, modular MERGEN Depaneling machines are developed, to separate PCB´s of different materials, stress free and almost dust free and without any damage, either mechanically or through electrostatic discharge. Depending on the requirements, sawing or milling process will be available. The MERGEN depaneling machines with their highly dynamic linear motor axes have been developed for special requirements with very strict tolerance limits. The separation of PCB´s can be realized with tolerances of less than ± 0.05mm. Also frameless products can be separated with the MDM1250. During the entire process, the wear of the milling tool is compensated and monitored to realize the high quality and long tool life time. Key Data MDM1250: Developed and manufactured acc. to SMEMA-9851 or Hermes-9852 CE-Standard Automatic transport by segmented transport or by servo driven pushers – First segment as waiting position, second segment in separation position Removal of the waste frames via segment transport or with the gripper system Handling of the milled circuit boards with the manipulator Grippers are supplied adapted to the PCB shapes and dimensions and exchanged by a quick-change system The path control are realized by a NCI control – PLC are Beckhoff Any geometric form, including circles and curves can be realized with the tolerance accuracy Modification and adaptions of the path can be carry out by own personnel at any time, no knowledge of programming is necessary Creation of a milling program with CAD data or via HMI possible PCB thickness from 0,8mm until 4,0mm with material: CEM1 / FR2 / FR3 / FR4 / FR4 -05 / FR5 und Isola 117 (Standard pcb´s) Max. PCB dimension 500x320mm Milling of aluminium or other materials are also possible Assembled pcb hight can be handled on the milling side within 7mm, on the gripper side within 40mm Contact us for more options and informations. ...we meet your expectations