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Via in pad can present reliability challenges, as Zach Peterson shows in this video. This video presents data from the IPC HDPUG and SMTA studies. #pcbmanufacturing #pcbdesign #electronics #electronicsdesign #altium #altiumdesigner #signalintegrity #ferrite RELATED VIDEOS: What's Wrong With PCB Via Impedance Calculators?: • What's Wrong With PCB Via Impedance Calcul... How Many Stitching Vias Does Your PCB Need?: • How Many Stitching Vias Does Your PCB Need... 👉 Follow Zachariah Peterson on LinkedIn: / zachariah-peterson 👉 Looking for PCB design services? Find me at: https://www.nwengineeringllc.com 👉 Zach's PCB design presentations, videos, and papers: https://www.zachariahpeterson.com/ 👉 Subscribe to Altium Academy: / @altiumacademy 0:00 - Intro 1:57 - When to Use Via in Pad 3:01 - Example: Ethernet Switch BGA Without Via in Pad 4:42 - Example: QFN With 0.5 mm Pitch Using Via in Pad 6:32 - Reliability Concerns With Via in Pad 9:47 - Reliability Studies: Package Type Comparison 12:13 - 57% Lifetime Increase Without Via in Pad (BGA 192) 14:52 - Failure Modes Related to Size and Materials 16:28 – Outro WHO IS ZACH PETERSON? Zachariah Peterson is a well-known PCB design expert, electronics design consultant, and dynamic speaker. He works with industry-leading ECAD/EDA software companies, electronics manufacturers, and OEMs providing technical consulting, strategy, and deeply technical content on PCB design and electronics manufacturing. He is also a contributor to popular engineering publications in the electronics industry and top-tier research journals.