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This clip talks the severe bottlenecks emerging in the global semiconductor supply chain as demand for artificial intelligence continues to surge. According to the core analysis, the production capacity of TSMC’s N3 process and high-bandwidth memory (HBM) is approaching its physical limits, and a significant supply–demand imbalance is expected to emerge around 2026. As demand for data center AI chips increasingly dominates the market, a clear zero-sum competition is forming in which production for traditional components used in smartphones and PCs is being displaced. In particular, while capital investment can increase rapidly, the expansion of physical manufacturing capacity requires much longer timelines. As a result, short-term capital injections alone cannot immediately resolve this structural shortage. Ultimately, this suggests that the growth of the AI industry is no longer simply additive to existing markets; rather, it has entered an extractive phase, expanding at the expense of the established consumer electronics supply chain.