#OFC24 скачать в хорошем качестве

#OFC24

Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt The big players are now making significant bets on co-packaged optics (CPO) as a driver a for the highest performance interconnects in AI clusters. Hamid Arabzadeh, CEO from Ranovus, gives us the update from #OFC24: The significant investment in co-packaged optics by major industry players like TSMC, Nvidia, Broadcom, AMD/Xilinx, SilTerra, and Mediatek, and how this technology is being utilized in AI and Edge AI applications where traditional modules don't fit. The development of a new generation of co-packaged optics that includes the laser inside the module, allowing for breakthroughs in power consumption and beachfront density where copper could not provide. The design and manufacturing process of these optics, integrating multiple components inside a single die, using the silicon photonics substrate as a packaging platform, and achieving substantially lower power consumption than other technologies. Keep up to speed with CPO, as it is poised to have a major impact of AI system design. Want to be involved our video series? Contact info@nextgeninfra.io