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HBM3E CUBE structure

The HBM3E cube contains one base logic die, which handles the overall management and interfacing of the memory stack. The cube includes several core dies (memory dies), which contain the actual memory cells and supports 256 DQ. So, 4 slices are minimum requirement for the HBM3E cube to provide 1024 DQ. The total number of channels in the HBM3E cube is 16. Each core die has 4 channels, and each channel has 64 DQ. 8 core die cube is widely used in these days. There are 2 tsv connection method. one is Multi-Drop Method. In the multi-drop method, TSVs are shared among multiple core dies. This approach requires multiplexers to manage the connections, as the same TSVs are used to connect multiple dies. this method can simplify the routing but may introduce latency or complexity due to multiplexing. the other method is Spiral P2P (Point-to-Point) connection. In the spiral P2P method, TSVs connect core dies in a direct point-to-point manner. This method aims to reduce the need for multiplexers and improve the directness and efficiency of the connections. this method can potentially offer better performance due to direct connections, reducing latency and complexity associated with multiplexers. The core-die floorplan is like this. to support 256 DQ, each Pseudo channel has 32 DQ because there are total 8 pseudo channels. it also support system ecc and on-die ecc. to compare with DDR4 and DDR5 sections, HBM3E has lots of small size mats and the CSL numbers also divided to meet the 1KB page size.