OCPREG19 - Eco-system Enabling of Liquid Cooling Ingredients Update скачать в хорошем качестве

OCPREG19 - Eco-system Enabling of Liquid Cooling Ingredients Update

Speakers: Jessica Gullbrand EW: Rack & Power / Advanced Cooling The continued demand for increased compute performance comes with an increase in server power and power density. The increased server power requires more efficient cooling capabilities compared to traditionally used air cooling. Direct liquid cooling using cold plates can provide the needed cooling capability, as well as fit within a small volume to allow for greater server and compute density in the rack. Even though liquid cooling is not a new cooling strategy for IT equipment, the industry is not ready to efficiently mass deploy liquid cooling solutions. Therefore, Intel is working to enable liquid cooling ingredients with industry partners. The intent is to create more available, lower risk, and faster time to market opportunity for OEMs to deploy liquid cooling solutions. Intels efforts are specifically focused on manifold distributed liquid cooling at the server rack level (i.e. the technology cooling system, TCS). The TCS is the fluid loop providing the cooling liquid from the Cooling Distribution Unit (CDU) through the rack manifold to the IT equipment cold plates, and then back again to the CDU through the rack manifold. The liquid cooling ingredients in the secondary loop included in Intels enabling efforts are cooling liquid, CDU, interchangeable Universal Quick Disconnects (UQD), and cold plates. Intels enabling efforts, together with Intels strategy to enable these ingredients was first introduced at the OCP Global Summit in March 2019, and an update on the eco-system enabling status will be presented at the OCP Regional Summit.