SEMICON Japan 2025 Highlight: Conprofe's Ultrasonic Deep Micro-Hole Drilling Solutions скачать в хорошем качестве

SEMICON Japan 2025 Highlight: Conprofe's Ultrasonic Deep Micro-Hole Drilling Solutions

We are thrilled to conclude a highly successful showcase at SEMICON Japan 2025 in Tokyo! At our booth, Conprofe presented our Ultrasonic Ultra-Deep Micro-Hole Machining Solutions for Advanced Materials, a complete turnkey offering that generated significant interest and engaged discussions with professionals across Asia. A key driver of our success was the on-the-ground expertise of our invaluable distributor partners. Special thanks to Mr. Daijiro Fukushima from DHT JAPAN and Mr. Harry Bae from Ceramic King, Korea, for their dedicated support and deep industry knowledge. Their efforts were crucial in connecting with clients and demonstrating Conprofe’s technological leadership. Looking ahead, we’re excited to announce ambitious collaborative initiatives: · Establishing an Technology Demonstration & Application Center in Japan with DHT JAPAN. · Expanding our partnership with Ceramic King—now our Primary PCD Tool Distributor in Korea—into full-category cooperation. SEMICON Japan 2025 highlighted how Conprofe's innovative Ultrasonic Machining Technology and Solid PCD Cutting Tools, combined with strong local partnerships, create exceptional value for the global advanced manufacturing sector. Ready to explore how our solutions can drive your projects forward? ↓↓↓ · Download Solution: https://we.tl/t-IsHq67TFU2 · Get in Touch: sales-international@conprofetech.com · Learn More: www.conprofecnc.com · Follow Us:   / conprofe-technology