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Accelonix Benelux distributor of Tresky Automation Die Bonders. For more information please visit : www.accelonix.nl Die Bonding Systems optimal for R&D, pilot and medium size production. With numerous available options, the bonders can be customized to best suit your needs. All Tresky Automation Die Bonders have an unique feature called ‘manual mode’, which means you can operate the machine without the need of programming. T-Series Performed to grow from a manual manufacturing process to a fully automated process without any additional hardware changes. Options At a similar level of importance comes the way the sample is handled on the T-Series during processing. The compatibility modes ensure consistency in your manufacturing results across machines. Technology The strength and accuracy of the bond is in proportion a significantly fact for a stable process. TRESKY’s automated die bonder product line has several unique technology solutions therefore available. Market Solutions We provide custom bonding solutions to a variety of industries. Find your industry to discover how Tresky GmbH can help you. Applications shown in this video: 00:00 Start 00:17 Conveyer / Indexer 01:06 Dispensing 01:27 Stamping 02:01 Chip to 12'' Wafer 02:38 Fine Pitch Stamping 06:24 Automatic Tool Change 06:31 Pick & Place 06:53 Eutectic Scrubbing 07:01 Eutectic 08:13 Die Stacking 09:21 Ultrasonic Bonding 09:54 Bonding TO CAN 13:35 Glas Frit Bonding 15:10 UV Indexer 15:26 Customized Applications