Co-Packaged Optics and the Future of Photonic Test at Scale скачать в хорошем качестве

Co-Packaged Optics and the Future of Photonic Test at Scale

Co-packaged optics (CPO) has rapidly emerged as one of the most significant innovations in the photonics industry, driven by the need to solve bandwidth, power, and density challenges at the silicon edge. In this discussion, Matt Adams explores why CPO has become a major catalyst for change and how it is influencing test strategies across the ecosystem. As CPO architectures introduce hundreds of parallel optical channels, test systems must scale far beyond traditional configurations. The need to support massive connector density, from MPOs to fiber array units, is driving new approaches to deploying power meters, switches, attenuators, and other photonic building blocks at unprecedented scale. At the same time, connector manufacturing volumes—both internal and external to CPO appliances—are increasing dramatically, placing new demands on connectivity testing. CPO also marks a turning point for silicon photonics, with large foundries entering the space and testing shifting upstream from end-of-line systems to wafer-level and pre-packaged devices. The use of external light sources fundamentally changes how devices are validated, requiring precise control of power, linewidth, polarization, and extinction. Together, these shifts make CPO a generational challenge—and a multi-year driver of innovation in photonic test and measurement. #CoPackagedOptics #PhotonicsTesting #SiliconPhotonics #AIDatacenters For more information, please visit: https://www.viavisolutions.com -- Contact a Sales Expert https://viavisolutions.link/contact-s... Request a Demo https://viavisolutions.link/demo Request a Quote https://viavisolutions.link/quote FOLLOW US Facebook:   / viavisolutions   Instagram:   / viavifiber   LinkedIn:   / viavi-solutions   Twitter:   / viavisolutions   YouTube:    / viavisolutions