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Huawei has sent shockwaves through the global tech industry by reportedly testing its first self-developed EUV lithography machine for 3nm chip production. After years of sanctions and Western dominance in semiconductor technology, China’s breakthrough in laser-induced discharge plasma (LDP) could redefine the global chip race. If successful, it may challenge ASML’s monopoly and accelerate China’s path toward semiconductor independence. This new leap signals more than just technological progress—it’s a geopolitical turning point. As Huawei and SMIC move closer to mass production by 2026, the balance of power in global chipmaking may be about to shift forever. 📢 COPYRIGHT NOTICE ChipCrunch does not fully own 'SOME' of the materials featured in this video. The original content belongs to individuals or organizations who deserve full credit and respect. We use certain clips under Section 107 of the Copyright Act of 1976, which allows “fair use” for purposes like criticism, commentary, news reporting, teaching, scholarship, and research. If you are the rightful owner of any material used and have concerns, please let us know in the comments. ⬇️ We’ll follow your request promptly. Thank You! ✅