Inside the Mind of a Semiconductor CEO: Chiplets, AI, and the Future of Advanced Packaging скачать в хорошем качестве

Inside the Mind of a Semiconductor CEO: Chiplets, AI, and the Future of Advanced Packaging

In this episode of the Semiconductor Leadership Podcast, host Salah Nasri sits down with Chandran Nair, CEO of UVJC and a veteran semiconductor executive with nearly three decades of experience across test, instrumentation, advanced packaging, and equipment manufacturing. From his early days at National Instruments to leading global organizations and now shaping the future of advanced packaging, chiplets, and silicon photonics, Chandran shares unfiltered insights into what it truly takes to scale innovation in the semiconductor industry. This conversation dives deep into chiplet integration, AI-driven workloads, advanced packaging bottlenecks, and why customer-led innovation beats price-driven competition. Chandran also reveals the leadership principles behind walking away from a deal—and why it ultimately led to a $70M win. Whether you’re a semiconductor executive, engineer, startup founder, or simply passionate about the future of chips, this episode is packed with real-world lessons, strategic thinking, and leadership wisdom. Topics Covered: • Advanced packaging & chiplet architecture • Semiconductor test and equipment strategy • AI workloads and silicon photonics • Why walking away from customers can win big • Scaling semiconductor startups vs incumbents • Customer-first innovation in high-tech manufacturing • Leadership, culture, and global team alignment • The future of semiconductor manufacturing