晶圓移載系統 EFEM+DMT скачать в хорошем качестве

晶圓移載系統 EFEM+DMT

【晶圓移載系統】 AI時代的來臨帶動強大的整合運算需求，宛如AI大腦的半導體晶片需求更是與日俱增，為了讓晶圓製程行雲流水，精密且有效率的解決方案更是不可或缺。HIWIN透過軟硬體的垂直整合，打造晶圓移載系統(EFEM320-D06)，是一台提供客製化晶圓或金屬載盤搬運需求的多元化設備，並能依實際製程要求進行彈性調整，滿足不同客戶的需求。 搭載大銀超薄型大中空精密直驅馬達（DMT 系列），可使設備走線與配管設計更加簡潔。中空孔徑最大可達 340 mm，厚度最薄僅 22 mm，能有效降低設備重心，減少運轉時產生的震動，使系統運作更穩定。搭配奈米級定位精度，深受半導體 AI 晶片設備大廠青睞，廣泛應用於雙面缺陷檢測、紅外線顯微鏡檢測、白光干涉量測等特殊製程領域。 ------------------------------------------------------------- 【EFEM+DMT】 The advent of the AI has driven strong demand for integrated computing, and the demand for semiconductor chips like the brain of AI is increasing day by day. In order to meet the process requirements, a sophisticated and efficient integrated system is indispensable. HIWIN has developed Equipment Front End Module (EFEM320-D06) through the vertical integration of software and hardware. It is a diversified and customized equipment for wafer or metal frame carrier needs., and can be flexibly adjusted according to actual process requirements to meet the needs of different customers. Featuring HIWIN MIKROSYSTEM Direct Drive Motors (DMT series) has ultra-thin, large aperture, with a hollow size up to 340 mm and a thickness of only 22 mm, are favored by semiconductor AI chip makers for applications like double-sided defect inspection, infrared microscopy and white light interferometry. #EFEM #上銀 #晶圓移載 #半導體