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Huawei’s 3nm EUV Breakthrough: China’s Semiconductor Revolution Explained Description: The global semiconductor industry is on the brink of a historic shift, and Huawei is at the center of it. For decades, the West—led by Intel, TSMC, and ASML—has dominated advanced chipmaking. Extreme Ultraviolet Lithography (EUV) technology, costing over $350 million per machine, has been the crown jewel of producing the world’s most powerful chips. China was blocked from accessing EUV due to US sanctions, leaving Huawei and SMIC reliant on older Deep Ultraviolet (DUV) systems. But now, Huawei is reportedly testing its homegrown EUV machine using a revolutionary laser-induced discharge plasma (LDP) method, aiming for 3-nanometer chip production by 2026. This breakthrough could challenge Western dominance, transform the global supply chain, and redefine the future of AI, smartphones, and supercomputing. In this video, we break down: Huawei’s response to US sanctions and semiconductor restrictions How LDP-based EUV differs from ASML’s billion-dollar systems The potential impact on the global semiconductor market Why 3-nanometer chips are a game-changer for performance, efficiency, and AI The strategic importance of China achieving technological self-reliance If Huawei succeeds, Western chipmakers may face a new rival, and the global semiconductor landscape could be permanently altered. This isn’t just tech news—it’s a story of strategy, ambition, and the race for technological supremacy.