Optical Compute Interconnect Co packaged optics for AI and compute infrastructure 1 скачать в хорошем качестве

Optical Compute Interconnect Co packaged optics for AI and compute infrastructure 1

"Christian Urricariet (Sr. Director Of Product Marketing- Integrated Photonics Solutions- Intel) - Intel Future compute fabrics for AI acceleration will require exponential increases in I/O bandwidth and reach in connectivity. Optical I/O can support higher bandwidth density with high energy efficiency- low latency- and longer reach. Intel‚as 4 Tbps OCI chiplet based on its in-house Silicon Photonics technology- co-packaged with next-generation CPU/GPU and other SOCs- addresses this need. The OCI chiplet contains a single Silicon Photonics Integrated Circuit (PIC) with integrated lasers and optical amplifiers (SOA)- and an electrical IC. At OFC 2024- Intel demonstrated its first OCI chiplet design co-packaged with a concept Intel CPU running an error-free link over fiber. Intel‚as mature Silicon Photonics platform has shipped more than 8 million PICs with over 32 million on-chip lasers- embedded in pluggable transceiver modules for data center connectivity- with industry-leading reliability."