Introduction to AIM Photonics and NY Creates PICs and Packaging Capabilities скачать в хорошем качестве

Introduction to AIM Photonics and NY Creates PICs and Packaging Capabilities

Sign up to our CA DREAMS Technical Seminar Series events: https://ca-dreams.org/events EVENT DETAILS: This presentation will provide an overview of the Photonic and Packaging Capabilities of NY Creates and AIM Photonics. AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the world-class 300 mm NY Creates’ Albany NanoTech Complex, which houses the Center for Semiconductor Research, CMOS Fabrication, Heterogeneous Integration, and High NA EUV Centers. The Institute’s PIC technologies include a full-featured CLO Silicon Photonics (SiPh) base technology, quantum-optimized SiPh, SiN-only for sensors and other applications, and base SiPh with III-V quantum dot lasers providing a broad set of PICs across all the major photonic application areas. 300 mm electronic-photonic interposers provide a unique platform for large-area packaging substrates with SiPh and waveguides. The NY Creates HI center provides dense interconnects, including C4, C2, Cu-Cu, wafer, and die-to-wafer hybrid bonding and advanced packaging build capabilities, including wafer and chip-level assembly and packaging. EPDA, process design kits, and assembly design kits enable design across all PIC, interposer, and packaging offerings. Another challenge is building a skilled workforce for the industry. This talk also will share an overview of AIM Photonics and NY Creates education and workforce development programs, including online and hands-on offerings. SPEAKER BIO: David Harame received his Ph.D. in Electrical Engineering from Stanford University. He is the COO of AIM Photonics and the Associate Vice President for NY Creates, managing photonics, electronic photonic design automation, test, assembly, and packaging technical areas. He has been with AIM Photonics since 2019. In his current position, David Harame manages all the technology development in the photonics and packaging areas for AIM Photonics in Albany, NY, at the Albany NanoTech Center and Rochester, NY, at the Test Assembly and Packaging facility. Prior to joining AIM Photonics, David Harame was a GLOBALFOUNDRIES Fellow and CTO for Development and Enablement. David was an IBM Fellow and CTO for Development and Enablement at IBM before joining GLOBALFOUNDRIES. David Harame is an IEEE Fellow and received the IEEE Daniel E. Noble Award in Emerging Technologies “For the development of manufacturable Silicon Germanium, HBT Bipolar and BiCMOS technologies.” David is best known for his work bringing SiGe BiCMOS into manufacturing. David also worked on foundry enablement and technology development for RF CMOS, RF PD, and FD SOI technologies.