[S12] Localized Thermal Vias for Temperature Reduction in 3D Multicore Processors – Melvin Galicia скачать в хорошем качестве

[S12] Localized Thermal Vias for Temperature Reduction in 3D Multicore Processors – Melvin Galicia

dr Melvin Galicia Motorola Solutions Poland; Łódź University of Technology Abstrakt: 3D stacking of integrated circuits is a promising idea for increasing the processor performance. However, the major challenge is overcoming thermal issues due to excessive power density. In 2015, using Intel’s Haswell processor as an example, we analyzed the thermal behavior of an eight-core processor implemented as a 2D chip and as a 3D architecture with two layers. We also investigated the use of localized thermal vias for improving the thermal behaviour of the 3D stack. We showed that the peak temperature can be significantly reduced due to the implementation of thermal vias. Four years later ,what is the industry implementing on processors design and thermal management?​