KGD 2020 - Bernice Zee: Advanced Packaging Failure Analysis Challenges скачать в хорошем качестве

KGD 2020 - Bernice Zee: Advanced Packaging Failure Analysis Challenges

KGD Workshop 2020 "Advanced Packaging Failure Analysis Challenges" Bernice Zee AMD Moore’s Law is progressively slowing as barriers to traditional monolithic scaling become increasing prohibitive to keep up with. In addition, the advent of machines learning (ML), artificial intelligence (AI) and the internet of things (IOT) are driving the need for higher performance/bandwidth, smaller form factors and lower power solutions for electronics. This has fueled the development of new semiconductor packages such as Embedded Multi-Die Interconnect Bridge (EMIB), Wafer Fan-Out and 2.5D packages. However, failure analysis (FA) of these new packages poses challenges to the traditional way of package level failure analysis. This talk aims to highlight some of the challenges faced as well as current FA workflow demonstrated by case studies applications.